Mannan, S. H.,
Paknejad, S. A.,
Mansourian, A. &
Khtatba, K. M. A.,
1 Dec 2018, (Accepted/In press)
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. Siow, K. (ed.).
SpringerResearch output: Chapter in Book/Report/Conference proceeding › Chapter